Bottom-fed Film Automatic 3D Bag Packaging Machine

Short Description:

Category:Snack Food Equipment

Applicable Products:Suitable for multi-pack products, such as wafers, puffed snacks, and biscuits.


Product Detail

Product Tags

Usage Environment Conditions

1 Site Requirements: Indoor use; the floor must be level, free from vibration and unevenness.
2 Floor Surface Requirements: Must be a hard, non-conductive floor surface (e.g., concrete, tiles, etc.).
3 Ambient Temperature: -5°C to 40°C
4 Relative Humidity: <75% RH, no condensation
5 Dust: No conductive dust
6 Gases: No flammable or explosive substances or gases; no corrosive gases that severely damage metal
7 Altitude: ≤ 1000 meters
8 Grounding Requirements: Independent, safe, and reliable grounding system
9 Power Supply Requirements: Stable power supply; voltage fluctuation should not exceed ±10%
10 Other Requirements: Measures must be taken to prevent rodents (such as rats) from entering the area.

Product Parameters

Voltage Frequency Packaging Speed Packaging Dimensions L*W*H Device Dimensions
AC 220V 50~60Hz 20~160bags/min (80~500)*(70~260)*(20~65)mm 6000*1500*1700mm

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